<span style="text-wrap: wrap;">基于激光诱导热压键合技术的Cu-Au异质纳米连接</span>

doi:10.1088/2631-7990/ad8736

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Wan H, Shu Y, Chen S, Cao H, Zhou S J, Liu S, Gui C Q. 2025. Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining. Int. J. Extrem. Manuf. 7 015101. DOI: 10.1088/2631-7990/ad8736

Citation:

Wan H, Shu Y, Chen S, Cao H, Zhou S J, Liu S, Gui C Q. 2025. Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining. Int. J. Extrem. Manuf. 7 015101. DOI: 10.1088/2631-7990/ad8736

Citation:

Wan H, Shu Y, Chen S, Cao H, Zhou S J, Liu S, Gui C Q. 2025. Laser-induced thermo-compression bonding for Cu-Au heterogeneous nanojoining. Int. J. Extrem. Manuf. 7 015101. DOI: 10.1088/2631-7990/ad8736

基于激光诱导热压键合技术的Cu-Au异质纳米连接

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基于激光诱导热压键合技术的Cu-Au异质纳米连接

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