<span style="text-wrap: wrap;">面向芯片先进封装的激光诱导热冲击效应和热弹性应力波精准调控超薄晶圆解键合行为研究</span>

doi:10.1088/2631-7990/ad8a26

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Zhang J Y, Hu Y L, Wang F C, Liu Q, Niu F F, Li J H, Huang M Q, Zhang G P, Sun R. 2025. Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips. Int. J. Extrem. Manuf. 7 015005. DOI: 10.1088/2631-7990/ad8a26

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Zhang J Y, Hu Y L, Wang F C, Liu Q, Niu F F, Li J H, Huang M Q, Zhang G P, Sun R. 2025. Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips. Int. J. Extrem. Manuf. 7 015005. DOI: 10.1088/2631-7990/ad8a26

Citation:

Zhang J Y, Hu Y L, Wang F C, Liu Q, Niu F F, Li J H, Huang M Q, Zhang G P, Sun R. 2025. Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips. Int. J. Extrem. Manuf. 7 015005. DOI: 10.1088/2631-7990/ad8a26

面向芯片先进封装的激光诱导热冲击效应和热弹性应力波精准调控超薄晶圆解键合行为研究

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面向芯片先进封装的激光诱导热冲击效应和热弹性应力波精准调控超薄晶圆解键合行为研究

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