Zhang C J, Yang Q, Li H Y, Luo Z X, Lu Y, Zhang J L, Li C, Chen F. 2025. 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics. Int. J. Extrem. Manuf. 7 035004. DOI: 10.1088/2631-7990/ada835
Citation:
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Zhang C J, Yang Q, Li H Y, Luo Z X, Lu Y, Zhang J L, Li C, Chen F. 2025. 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics. Int. J. Extrem. Manuf. 7 035004. DOI: 10.1088/2631-7990/ada835
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Zhang C J, Yang Q, Li H Y, Luo Z X, Lu Y, Zhang J L, Li C, Chen F. 2025. 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics. Int. J. Extrem. Manuf. 7 035004. DOI: 10.1088/2631-7990/ada835
Citation:
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Zhang C J, Yang Q, Li H Y, Luo Z X, Lu Y, Zhang J L, Li C, Chen F. 2025. 3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics. Int. J. Extrem. Manuf. 7 035004. DOI: 10.1088/2631-7990/ada835
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