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Gao S, Wang H X, Huang H, Dong Z G, Kang R K. 2025. Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding. Int. J. Extrem. Manuf. 7 035103. DOI: 10.1088/2631-7990/adae67
Citation: Gao S, Wang H X, Huang H, Dong Z G, Kang R K. 2025. Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding. Int. J. Extrem. Manuf. 7 035103. DOI: 10.1088/2631-7990/adae67

半导体材料精密磨削中表面粗糙度与亚表面损伤深度的预测模型

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